pb lead-free parts ly3330-pf/trf-x tape and reel type led lamps ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-ly3330-pf/trf-x rev. : a date : 09 - nov. - 2007
ligitek electronics co.,ltd. property of ligitek only 1/7 page w2 f - + w3 w1 p2 h package dimensions l w0 ly3330-pf/trf-x part no. h2 h1 p1 h t 7.6 8.6 5.0 5.9 + - 1.0min 2.54typ 25.0min ly3330-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 0.5 typ 1.5max p d
ly3330-pf/trf-x2/7 page ma unit ratings 20 y i f parameter forward current symbol ligitek electronics co.,ltd. property of ligitek only a mw luminous intensity @10ma(mcd) viewing angle 2 1/2 (deg) 28 2030 typ. min. 10 60 -40 ~ +100 -40 ~ +85 ir pd t opr tstg storage temperature operating temperature power dissipation reverse current @5v 20 spectral halfwidth nm peak wave length pnm 2.6 1.7 35 585 lensmin. part nomaterial yellow gaasp/gap ly3330-pf/trf-x emitted note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. yellow diffused color forward voltage @ ma(v) max. peak forward current duty 1/10@10khz i fp 80 ma typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 part no.
part no. ly3330-pf/trf-x 0.17 0.08 0.23 0.77 0.96 0.83 0.89 0.83 0.83 1.04 0.65 1.1 0.91 1.02 0.43 0.18 0.51 1.42 0.06 0.61 0.38 0.75 0.16 0.3 0.89 ligitek electronics co.,ltd. property of ligitek only minimum specifications option code symbol 4.2 3.80.15 2.0 -------------- 5.8 4.80.19 ------- d ------- ------- h f mm mm inch front-to-rear deflection component lead pitch dimensions symbol information ? tape feed hole diameter symbol items 19.5 17.50.69 24.5 22.50.89 21.0 19.00.75 ------- trf-1 trf-3 trf-2 22.5 21.50.85 21.125 17.1250.67 21.2 20.20.8 trf-5 trf-7 h1 trf-6 26.5 25.51.0 trf-4 feed hole to bottom of component 16.5 15.5 h0.61 height of seating plane 28.0 26.01.02 23.0 21.00.83 26.0 24.00.94 trf-9 trf-12 trf-11 11.0 w0 4.55 3.150.12 13.0 12.40.49 l ------- p1 ------- p ------- 36 ------- h2 ------- ------- lead location feed hole pitch feed hole to overall component height lead length after component height 1.42 -------------- 15.5 14.50.57 9.75 8.50.33 t ------- w1 ------- w0 ------- 19.0 17.50.69 package dimensions ? w3 ------- 04.0 w20 ------- adhesive tape width feed hole location tape width adhesive tape position overall taped package thickness dimensions symbol information ? remark:trf=tape and reel forming leads 7.7 5.1 p2 0.2 center of component location ------- d3 marking mm inch mm symbol minimum 380 3.08 102 1.37 78.2 d 34.9 d1 14.96 inch maxmum 4.02 t1 88.0 1.13 38.1 0.54 28.6 d2 13.8 d3 57.2 --- 50.0 1.18 --- t 30.0 t1 3.46 2.25 1.5 1.97 d description reel diameter core diameter arbor hole diameter overall reel thickness hub recess inside diameter iside reel flange thickness 1000pcs ly3330-pf/trf-x specification 22.5 20.00.79 trf-8 page 3/7 inch maximum d1 d2 t2
part no. ly3330-pf/trf-x page 4/7 ligitek electronics co.,ltd. property of ligitek only minimum specifications maximum 0.17 0.08 0.23 0.154.2 3.8 ------- 2.0 ------- 0.19 4.85.8 inch inch mm mm option code dimensions symbol information ? symbol items ------- ------- ------- component lead pitch tape feed hole diameter front-to-rear deflection h d f symbol 0.79 0.93 0.93 0.75 20.0 19.0 0.89 23.5 22.5 0.85 21.723.7 0.77 1.08 0.85 0.73 19.5 18.5 1.027.5 25.5 20.5 0.8121.5 17.518.0 0.69 0.71 ------- trf-13 trf-15 trf-14 trf-17 trf-19 trf-18 feed hole to bottom of component trf-16 h1 0.65 0.61 15.5 16.5 height of seating plane h 1.06 0.91 0.9827.0 25.0 0.87 22.023.0 0.43 0.18 0.51 11.0 w0 l 0.124.55 3.15 0.49 12.413.0 1.42 ------- ------- 36 trf-21 trf-22 ------- ------- ------- lead location feed hole pitch lead length after component height ------- feed hole to overall component height p1 p h2 0.06 0.61 0.38 ------- 1.42 ------- t 0.5715.5 14.5 0.33 8.59.75 0.75 0.6919.0 17.5 package dimensions ? 0.16 004.0 ------- ------- ------- adhesive tape width feed hole location overall taped package thickness ------- tape width remark:trf=tape and reel forming leads dimensions symbol information ? ------- adhesive tape position w3 w2 w1 w0 0.3 0.2 5.17.7 ------- center of component location p2 d3 inch 14.96 4.02 marking d2 d1 3.46 1.5 2.25 1.97 t2 t1 d mm inch symbol mm minimum 380 3.08 102 1.37 d d1 78.2 34.9 description reel diameter core diameter 88.0 1.13 38.1 0.54 d2 d3 28.6 13.8 57.2 --- 50.0 1.18 t t1 --- 30.0 arbor hole diameter hub recess inside diameter overall reel thickness iside reel flange thickness maxmum 1000pcs ly3330-pf/trf-x specification 0.89 0.81 20.522.5 trf-20
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip part no. page 5/7 ly3330-pf/trf-x fig.6 directivity radiation
5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 0 0 50 preheat 25 120 2 /sec max time(sec) 100 150 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 260 temp( c) ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ly3330-pf/trf-x part no. page 6/7
jis c 7021: b-12 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. low temperature storage test the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition test item 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test part no. reliability test: ly3330-pf/trf-x reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 7/7
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